SOFT CLAY DRAINAGE CONSOLIDATION USING ELECTRICALLY CONDUCTIVE WICK DRAINS (ECWD)
Wei-lie Zou, Yan-feng Zhuang, Xie-qun Wang, Sai K. Vanapalli
Dans les comptes rendus d’articles de la conférence: GeoQuébec 2015: 68th Canadian Geotechnical Conference & 7th Canadian Permafrost ConferenceSession: Problematic Soils and Ground Improvement II / Sols problématiques et amélioration du comportement II
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Zou, Wei-lie, Zhuang, Yan-feng, Wang, Xie-qun, Vanapalli, Sai K. (2015) SOFT CLAY DRAINAGE CONSOLIDATION USING ELECTRICALLY CONDUCTIVE WICK DRAINS (ECWD) in GEO2015. Ottawa, Ontario: Canadian Geotechnical Society.
@inproceedings{Zou_GEO2015_148,
author = {{Zou, Wei-lie}, {Zhuang, Yan-feng}, {Wang, Xie-qun}, {Vanapalli, Sai K.}}
title = {SOFT CLAY DRAINAGE CONSOLIDATION USING ELECTRICALLY CONDUCTIVE WICK DRAINS (ECWD)}
booktitle = {Proceedings of the 68th Canadian Geotechnical Conference & 7th Canadian Permafrost Conference}
year = {2015}
organization = {The Canadian Geotechnical Society},
address = {Ottawa, Canada} }
title = {SOFT CLAY DRAINAGE CONSOLIDATION USING ELECTRICALLY CONDUCTIVE WICK DRAINS (ECWD)}
booktitle = {Proceedings of the 68th Canadian Geotechnical Conference & 7th Canadian Permafrost Conference}
year = {2015}
organization = {The Canadian Geotechnical Society},
address = {Ottawa, Canada} }